Semiconductor device and method of manufacturing semiconductor device

ABSTRACT

A first transistor includes a first impurity layer of a first conduction type formed in a first region of a semiconductor substrate, a first epitaxial semiconductor layer formed above the first impurity layer, a first gate insulating film formed above the first epitaxial semiconductor layer, a first gate electrode formed above the first gate insulating film, and first source/drain regions of a second conduction type formed in the first epitaxial semiconductor layer and in the semiconductor substrate in the first region. A second transistor includes a second impurity layer of the first conduction type formed in a second region of the semiconductor substrate, a second epitaxial semiconductor layer formed above the second impurity layer and being thinner than the first epitaxial semiconductor layer, a second gate insulating film formed above the second epitaxial semiconductor layer, a second gate electrode formed above the second gate insulating film, and second source/drain regions of the second conduction type formed in the second epitaxial semiconductor layer and in the semiconductor substrate in the second region.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority of theprior Japanese Patent Application No. 2010-220777, filed on Sep. 30,2010, the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to a semiconductor deviceand a method of manufacturing a semiconductor device.

BACKGROUND

As semiconductor devices are downsized and highly integrated, thefluctuations of the threshold voltages of the transistors due tostatistical fluctuations of the channel impurity becomes conspicuous.The threshold voltage is one of important parameters for deciding theperformance of the transistors, and to manufacture semiconductor deviceof high performance and high reliability, it is important to decreasethe fluctuations of the threshold voltage due to the statisticalfluctuations of the impurity.

As one technique of decreasing the fluctuations of the threshold voltagedue to the statistical fluctuations is proposed the technique that anon-doped epitaxial silicon layer is formed on a highly doped channelimpurity layer having a steep impurity concentration distribution.

The following are examples of related: U.S. Pat. No. 6,482,714; U.S.Patent Publication No. 2009/0108350; A. Asenov, “Suppression of RandomDopant-Induced Threshold Voltage Fluctuations in Sub-0.1-μm MOSFET'swith Epitaxial and δ-doped Channels”, IEEE Transactions on ElectronDevices, vol. 46, No. 8. p. 1718, 1999; Woo-Hyeong Lee, “MOS DeviceStructure Development for ULSI: Low Power/High Speed Operation”,Microelectron. Reliab., Vol. 37, No. 9, pp. 1309-1314, 1997; and A.Hokazono et al., “Steep Channel Profiles in n/pMOS Controlled byBoron-Doped Si:C Layers for Continual Bulk-CMOS Scaling”, IEDM09-673.

No method for incorporating the proposed techniques described above inthe semiconductor device manufacturing processes have been specificallyproposed. Especially, new problems which will take place by adopting theabove-described techniques in manufacturing processes, and their solvingmeans have not been specifically studied.

SUMMARY

According to one aspect of an embodiment, there is provided a method ofmanufacturing a semiconductor device including ion implanting a firstimpurity of a first conduction type in a first region and a secondregion of a semiconductor substrate, activating the first impurity toform a first impurity layer in the first region and the second region,epitaxially growing a semiconductor layer above the semiconductorsubstrate with the first impurity layer formed in, forming above thesemiconductor layer a mask exposing the first region and covering thesecond region, removing partially the semiconductor layer in the firstregion by using the mask, forming a first gate insulating film above thesemiconductor layer after the mask is removed, and forming a first gateelectrode above the first gate insulating film in the first region and asecond gate electrode above the first gate insulating film in the secondregion.

According to another aspect of an embodiment, there is provided asemiconductor device including a first transistor including a firstimpurity layer of a first conduction type formed in a first region of asemiconductor substrate, a first epitaxial semiconductor layer formedabove the first impurity layer, a first gate insulating film formedabove the first epitaxial semiconductor layer, a first gate electrodeformed above the first gate insulating film, and first source/drainregions of a second conduction type formed in the first epitaxialsemiconductor layer and in the semiconductor substrate in the firstregion, and a second transistor including a second impurity layer of thefirst conduction type formed in a second region of the semiconductorsubstrate, a second epitaxial semiconductor layer formed above thesecond impurity layer and being thinner than the first epitaxialsemiconductor layer, a second gate insulating film formed above thesecond epitaxial semiconductor layer, a second gate electrode formedabove the second gate insulating film, and second source/drain regionsof the second conduction type formed in the second epitaxialsemiconductor layer and in the semiconductor substrate in the secondregion.

The object and advantages of the embodiment will be realized andattained by means of the elements and combinations particularly pointedout in the claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the embodiments, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 and 2 are diagrammatic sectional views illustrating a structureof a semiconductor device according to an embodiment;

FIGS. 3-20 are sectional views illustrating a method of manufacturingthe semiconductor device according to the embodiment;

FIGS. 21A-21D are sectional views illustrating a method of manufacturinga semiconductor device according to a first reference example;

FIGS. 22A-22B, 23A-23B and 24A-24B are sectional views illustrating amethod of manufacturing a semiconductor device according to a secondreference example; and

FIGS. 25A-25B, 26A-26B, 27A-27B, 28A-28B, 29A-29B and 30 are sectionalviews illustrating a method of manufacturing a semiconductor deviceaccording to a third reference example.

DESCRIPTION OF EMBODIMENTS An Embodiment

A semiconductor device and a method of manufacturing a semiconductordevice according to an embodiment will be described with reference toFIGS. 1 to 20.

FIGS. 1 and 2 are diagrammatic sectional views illustrating a structureof the semiconductor device according to the present embodiment. FIGS.3-20 are sectional views illustrating a method of manufacturing thesemiconductor device according to the present embodiment.

First, the structure of the semiconductor device according to thepresent embodiment will be described with reference to FIGS. 1 and 2.

Above a silicon substrate 10, a low-threshold voltage/low-voltage NMOStransistor (LVt LV NMOS) and a low-threshold voltage/low-voltage PMOStransistor (LVt LV PMOS) are formed. These low-thresholdvoltage/low-voltage transistors are transistors having a low thresholdvoltage which operate at low voltage and are used in a circuit unitwhich requires high speed operation.

Above the silicon substrate 10, a high-threshold voltage/low-voltageNMOS transistor (HVt LV NMOS) and a high-threshold voltage/low-voltagePMOS transistor (HVt LV PMOS) are formed. These high-thresholdvoltage/low-voltage transistors are transistors having a high thresholdvoltage which operate at low voltage and are used in a circuit unitwhich requires low leakage current.

Above the silicon substrate 10, a high voltage NMOS transistor (HV NMOS)and a high voltage PMOS transistor (HV PMOS) are formed. These highvoltage transistors are used in a circuit unit, e.g., 3.3V I/O, whichhigh voltage is applied to.

The high-threshold voltage/low-voltage NMOS (HVt LV NMOS) is formed in ahigh-threshold voltage/low-voltage NMOS transistor forming region 16H ofthe silicon substrate 10.

In the silicon substrate 10 in the high-threshold voltage/low-voltageNMOS transistor forming region 16H, a p-well 20 and a p-type highlydoped impurity layer 22 are formed. Above the p-type highly dopedimpurity layer 22, a silicon layer 48 epitaxially grown on the siliconsubstrate 10 is formed. Above the silicon layer 48, a gate insulatingfilm 64 a is formed. Above the gate insulating film 64 a, a gateelectrode 66 is formed. In the silicon layer 48 and the siliconsubstrate 10 on both sides of the gate electrode 66, source/drainregions 78 are formed. Thus, the high-threshold voltage/low-voltage NMOStransistor (HVt LV NMOS) is formed.

The low-threshold voltage/low-voltage NMOS transistor (LVt LV NMOS) isformed in a low-threshold voltage/low-voltage NMOS transistor formingregion 16L of the silicon substrate 10.

In the silicon substrate 10 in the low-threshold voltage/low-voltageNMOS transistor forming region 16L, a p-well 20 and a p-type highlydoped impurity layer 22 are formed. Above the p-type highly dopedimpurity layer 22, a silicon layer 48 epitaxially grown on the siliconsubstrate 10 is formed. Above the silicon layer 48, a gate insulatingfilm 64 a is formed. Above the gate insulating film 64 a, a gateelectrode 66 is formed. In the silicon layer 48 and the siliconsubstrate 10 on both sides of a gate electrode 66, source/drain regions78 are formed. Thus, the low-threshold voltage/low-voltage NMOStransistor (LVt LV NMOS) is formed.

The p-well 20 and the p-type highly doped impurity layer 22 in thehigh-threshold voltage/low-voltage NMOS transistor forming region 16Hand the low-threshold voltage/low-voltage NMOS transistor forming region16L are simultaneously formed and have the same impurity concentrationdistribution.

The threshold voltage of the high-threshold voltage/low-voltage NMOStransistor (HVt LV NMOS) and the low-threshold voltage/low-voltage NMOStransistor (LVt LV NMOS) are adjusted by the film thickness differenceof the silicon layer 48. That is, the film thickness of the siliconlayer 48 formed in the high-threshold voltage/low-voltage NMOStransistor forming region 16H is thinner than the film thickness of thesilicon layer 48 formed in the low-threshold voltage/low-voltage NMOStransistor forming region 16L. Thus, the threshold voltage of thehigh-threshold voltage/low-voltage NMOS transistor (HVt LV NMOS) ishigher than the threshold voltage of the low-thresholdvoltage/low-voltage NMOS transistor (LVt LV NMOS).

The low-threshold voltage/low-voltage PMOS (LVt LV PMOS) is formed inthe low-threshold voltage/low-voltage PMOS transistor forming region 24Lof the silicon substrate 10.

In the silicon substrate 10 in the low-threshold voltage/low-voltagePMOS transistor forming region 24L, an n-well 28 and an n-type highlydoped impurity layer 30 are formed. Above the n-type highly dopedimpurity layer 30, a silicon layer 48 epitaxially grown on the siliconsubstrate 10 is formed. Above the silicon layer 48, a gate insulatingfilm 64 a is formed. Above the gate insulating film 64 a, a gateelectrode 66 is formed. In the silicon layer 48 and the siliconsubstrate 10 on both sides of the gate electrode 66, source/drainregions 80 are formed. Thus, the low-threshold voltage/low-voltage PMOStransistor (LVt LV PMOS) is formed.

In the high-threshold voltage/low-voltage PMOS (HVt LV PMOS) is formedin a high-threshold voltage/low-voltage PMOS transistor forming region24H of the silicon substrate 10.

In the silicon substrate 10 of the high-threshold voltage/low-voltagePMOS transistor (HVt LV PMOS) forming region 24H, an n-well 28 and ann-type highly doped impurity layer 30 are formed. Above the n-typehighly doped impurity layer 30, a silicon layer 48 epitaxially grown onthe silicon substrate 10 is formed. Above the silicon layer 48, a gateinsulating film 64 a is formed. Above the gate insulating film 64 a, agate electrode 66 is formed. In the silicon layer 48 and the siliconsubstrate 10 on both sides of the gate electrode 66, source/drainregions 80 are formed. Thus, the high-threshold voltage/low-voltage PMOStransistor (HVt LV PMOS) is formed.

Here, the n-well 28 and the n-type highly doped impurity layers 30formed in the high-threshold voltage/low-voltage PMOS transistor formingregion 24H and the low-threshold voltage/low-voltage PMOS transistorforming region 24L are simultaneously formed and have the same impurityconcentration distribution.

The threshold voltages of the high-threshold voltage/low-voltage PMOStransistor (HVt LV PMOST) and the low-threshold voltage/low-voltage PMOStransistor (LVt LV PMOS) are adjusted by the film thickness differencebetween the silicon layers 48. That is, the thickness of the siliconlayer 38 formed in the high-threshold voltage/low-voltage PMOStransistor (HVt LV PMOS) formed region 24H is smaller than the thicknessof the silicon layer 48 formed in low-threshold voltage/low-voltage PMOStransistor (LVT Lv) PMOS. Thus, the threshold voltage of thehigh-threshold voltage/low-voltage PMOS transistor (Hvt LV PMOS) ishigher than the threshold voltage of the low-thresholdvoltage/low-voltage PMOS transistor (LVt LV PMOS).

The high voltage NMOS transistor (HV NMOS) is formed in a high voltageNMOS transistor forming region 32 of the silicon substrate 10.

In the silicon substrate 10 in the high voltage NMOS transistor formingregion 32, a p-well 36 and a p-type impurity layer 38 are formed. Toimprove the junction breakdown voltage, the p-type impurity layer 38 hasa lower concentration and a gradual impurity distribution than thep-type highly doped impurity layers 22 of the low voltage NMOStransistors. Above the p-type impurity layer 38, a silicon layer 48epitaxially grown on the silicon substrate 10 is formed. Above thesilicon layer 48, a gate insulating film 60 a thicker than the gateinsulating films 64 a of the low voltage transistors is formed. Abovethe gate insulating film 60 a, a gate electrode 66 is formed. In thesilicon layer 48 and the silicon substrate 10 on both sides of the gateelectrode 66, source/drain regions 78 are formed. Thus, the high voltageNMOS transistor (HV NMOS) is formed.

A high voltage PMOS transistor (HV PMOS) is formed in a high voltagePMOS transistor forming region 40 of the silicon substrate 10.

In the silicon substrate 10 in the high voltage PMOS transistor formingregion 40, an n-well 44 and an n-type impurity layer 46 are formed. Toimprove the junction breakdown voltage, the n-type impurity layer 46 hasa lower concentration and a gradual impurity distribution than then-type highly doped impurity layers 30 of the low voltage PMOStransistors. Above the n-type impurity layer 46, a silicon layer 48epitaxially grown on the silicon substrate 10 is formed. Above thesilicon layer 48, a gate insulating film 60 a thicker than the gateinsulating films 64 a of the low voltage transistors is formed. Abovethe gate insulating film 60 a, a gate electrode 66 is formed. In thesilicon layer 48 and the silicon substrate 10 on both sides of the gateelectrode 66, source/drain regions 80 are formed. Thus, the high voltagePMOS transistor (HV PMOS) is formed.

Above the gate electrodes 66 and the source/drain regions 78, 80 of therespective transistors, a metal silicide film 84 is formed.

Above the silicon substrate 10 with the transistors of the six kindsformed on, an inter-layer insulating film 86 is formed. In theinter-layer insulating film 86, contact plugs 88 connected to thetransistors are buried. To the contact plugs 88, interconnections 90 areconnected.

As described above, the semiconductor device according to the presentembodiment includes four kinds of low voltage transistors and two kindsof high voltage transistors.

As exemplified in FIG. 2, the low voltage transistors of the four kindseach include in the channel region 106, a highly-doped impurity layer108 having a steep impurity concentration distribution, and a non-dopedsilicon layer 110 epitaxially grown on the highly-doped impurity layer108. Such transistor structure is effective to suppress the thresholdvoltage fluctuations of the transistors due to the statisticalfluctuations of the impurity.

As described above, the threshold voltages of the high-thresholdvoltage/low-voltage NMOS transistor (HVt LV NMOS) and the low-thresholdvoltage/low-voltage NMOS transistor (LVt LV NMOS) are adjusted by thethickness difference of the silicon layers 48. Accordingly, it is notnecessary to differ the impurity profiles of the channel regions betweenthe high-threshold voltage/low-voltage NMOS transistor (HVt LV NMOS) andthe low-threshold voltage/low-voltage NMOS transistor (LVt LV NMOS),which can simplify the manufacturing process.

Similarly, the threshold voltages of the high-thresholdvoltage/low-voltage PMOS transistor (HVt LV PMOS) and the low-thresholdvoltage/low-voltage PMOS transistor (LVt LV PMOS) are also adjusted bythe thickness difference of the silicon layers 48. Accordingly, it isnot necessary to differ the impurity profiles of the channel regionsbetween the high-threshold voltage/low-voltage PMOS transistor (HVt LVPMOS) and the low-threshold voltage/low-voltage PMOS transistor (LVt LVPMOS), which can simplify the manufacturing process.

Making the respective thicknesses of the silicon layer 48 of the highthreshold voltage transistors and the silicon layer 48 of the lowthreshold voltage transistors equal to each other between the NMOStransistors and the PMOS transistors can further simplify themanufacturing process. Thus, the manufacturing cost can be decreased.

Next, the method of manufacturing the semiconductor device according tothe present embodiment will be described with reference to FIGS. 3 to20.

First, by photolithography and etching, a trench to be used as the markfor the mask alignment is formed in a region other than the product tobe formed region of the silicon substrate 10 (e.g., a scribe region).

In the method of manufacturing the semiconductor device according to thepresent embodiment, before device isolation insulating film 58 isformed, the wells and the channel impurity layers are formed. The trench12 is used as the mark for the mask alignment in the lithography processmade before the device isolation insulating film 58 is formed (e.g., thelithography process for forming the wells and the channel impuritylayers).

The wells and the channel impurity layers are formed before the deviceisolation insulating films 58 are formed so as to suppress the filmthickness decrease of the device isolation insulating film 58 inremoving the silicon oxide films 14, 52, 60 (refer to a first referenceexample and a second reference example described later).

Next, above the entire surface of the silicon substrate 10, a siliconoxide film 14 as the protection film of the surface of the siliconsubstrate 10 is formed by, e.g., thermal oxidation method (FIG. 3).

Next, by photolithography, a photoresist film 18 exposing the lowvoltage NMOS transistor forming regions and covering the rest region isformed. For the alignment for the photolithography, the trench 12 isused as the alignment mark.

Next, ion implantation is made with the photoresist film 18 as the maskto form a p-well 20 and p-type highly doped impurity layers 22 in thelow voltage NMOS transistor forming regions 16 (FIG. 4).

The p-well 20 is formed, e.g., by implanting boron ions (B⁺)respectively in 4 directions tilted to the normal direction of thesubstrate under the conditions of 150 keV acceleration energy and7.5×10¹² cm⁻² dose. The p-type highly doped impurity layers 22 areformed, e.g., by respectively implanting germanium ions (Ge⁺) under theconditions of 50 keV acceleration energy and 5×10¹⁴ cm⁻², carbon ions(C⁺) under the conditions of 3 keV acceleration energy and 3×10¹⁴ cm⁻²and boron ions (B⁺) under the conditions of 2 keV acceleration energyand 3×10¹³ cm⁻². Germanium acts to amorphize the silicon substrate 10 tothereby prevent the channeling of the boron ions and amorphize thesilicon substrate 10 to increase the probability of positioning thecarbon at the lattice points. The carbon positioned at the latticepoints acts to suppress the diffusion of boron. In view of this, it ispreferable to ion implant germanium before carbon and boron, and thep-well 20 is formed before the p-type highly doped impurity layers 22.

Next, by, e.g., ashing method, the photoresist film 18 is removed.

Then, by photolithography, a photoresist film 26 exposing the lowvoltage PMOS transistor forming regions and covering the rest region isformed. For the alignment for the photolithography, the trench 12 isused as the alignment mark.

Next, with the photoresist film 26 as the mask, ion implantation is madeto form an n-well 28 and n-type highly doped impurity layers 30 areformed in the low voltage PMOS transistor forming regions 24 of thesilicon substrate 10 (FIG. 5).

The n-well 28 is formed, e.g., by implanting respectively in 4directions tilted to the normal direction of the substrate phosphorusions (P⁺) under the conditions of 360 keV acceleration energy and7.5×10¹² cm⁻² dose and arsenic ions (As⁺) under the conditions of 80 keVacceleration energy and 6×10¹² cm⁻² dose. The n-type highly dopedimpurity layers 30 are formed, e.g., by implanting arsenic ions underthe conditions of 6 keV acceleration energy and 2×10¹³ cm⁻² dose, orantimony ions (Sb⁺) under the conditions of 20 keV-50 keV accelerationenergy (e.g., 20 keV) and 0.5×10¹³ cm⁻²-2.0×10¹³ cm⁻² dose (e.g.,1.5×10¹³ cm⁻²).

Next, by, e.g., ashing method, the photoresist film 26 is removed.

In the method of manufacturing the semiconductor device according to thepresent embodiment, the p-well 20 and the p-type highly doped impuritylayers 22 of the high-threshold voltage/low-voltage NMOS transistor (HVtLV NMOS) and the low-threshold voltage/low-voltage NMOS transistor (LVtLV NMOS) are simultaneously formed. The n-well 28 and the n-type highlydoped impurity layer 30 of the high-threshold voltage/low-voltage PMOStransistor (HVt LV PMOS) and the low-threshold voltage/low-voltage PMOStransistor (LVt LV PMOS) are simultaneously formed. Thus, thelithography step for implanting ions into the channel regions of the 4low voltage transistors is 2 steps.

On the other hand, when the high-threshold voltage/low-voltage NMOStransistor (Hvt LV NMOS) and the low-threshold voltage/low-voltage NMOStransistor (LVt LV NMOS) are separately formed by changingconcentrations or distributions of the p-well 20 and the p-type highlydoped impurity layers 22, the required lithography step is at least 2steps. Similarly, when the high-threshold voltage/low-voltage PMOStransistor (HVt LV PMOS) and the low-threshold voltage/low-voltage PMOS(LVt LV PMOS) are formed separately by changing concentrations anddistributions of the n-well 28 and the n-type highly doped impuritylayers 30, the required lithography step is at least 2 steps. Thelithography step required for the ion implantation into the channelregions of the 4 low voltage transistors is at least 4 steps.

Thus, according to the method of manufacturing the semiconductor deviceaccording to the present embodiment, in the process of the channel ionimplantation for the 4 low voltage transistors, the lithography stepscan be decreased by at least 2 steps (refer to a third reference exampledescribed later).

Then, by photolithography, a photoresist film 34 exposing the highvoltage NMOS transistor forming region and covering the rest region isformed. For the alignment for the photolithography, the trench 12 isused as the alignment mark.

Next, with the photoresist film 34 as the mask, ion implantation is madeto form a p-well 36 and a p-type impurity layer 38 in the high voltageNMOS transistor forming region 32 of the silicon substrate 10 (FIG. 6).

The p-well 36 is formed, e.g., by implanting respectively in 4directions tilted to the normal direction of the substrate boron ionsunder the conditions of 150 keV acceleration energy and 7.5×10¹² cm⁻²dose. The p-type impurity layer 38 is formed, e.g., by implanting boronions under the conditions of 2 keV acceleration energy and 5×10¹² cm⁻²dose. In the high voltage operative NMOS transistor, in view of makingthe impurity concentration distribution of the channel region gradual tothereby improve the junction breakdown voltage and the hot carrierimmunity, neither carbon nor germanium is ion implanted.

Next, by, e.g., ashing method, the photoresist film 34 is removed.

Next, by photolithography, a photoresist film 42 exposing the highvoltage PMOS transistor forming region and covering the reset region isformed. For the alignment for the photolithography, the trench 12 isused as the alignment mark.

Next, with the photoresist film 42 as the mask, ion implantation is madeto form an n-well 44 and an n-type impurity layer 46 in the high voltagePMOS transistor forming region 40 of the silicon substrate 10 (FIG. 7).

The n-well 44 is formed, e.g., by implanting respectively in 4directions tilted to the normal direction of the substrate phosphorusions at 360 keV acceleration energy and 7.5×10¹² cm⁻² dose. The n-typeimpurity layer 46 is formed, e.g., by implanting phosphorus ions at 2keV acceleration energy and 5×10¹² cm⁻² dose. In the high voltageoperative PMOS transistor, in view of making the impurity concentrationdistribution of the channel region gradual to thereby improve thejunction breakdown voltage and hot carrier immunity, phosphorus in placeof arsenic or antimony is ion implanted.

Next, by, e.g., ashing method, the photoresist film 42 is removed.

Next, thermal processing is made in an inert ambient atmosphere torecover ion implantation damages introduced in the silicon substrate 10while activating the implanted impurities. For example, the thermalprocessing is made in nitrogen ambient atmosphere on two stages of 600°C. and 150 seconds and 1000° C. and 0 second.

At this time, the p-type highly doped impurity layers 22, in whichgermanium and carbon are implanted together with boron, can suppress thediffusion of boron in comparison with the p-type impurity layer 38, inwhich boron alone is implanted. Thus, with the steep distribution of thep-type highly doped impurity layer 22 retained, the impurity of thep-type impurity layer 38 can be distributed broad.

The n-type highly doped impurity layer 30 is formed of arsenic orantimony, whose diffusion constant is smaller than phosphorus implantedin the n-type impurity layer 46, whereby with the steep distribution ofthe n-type highly doped impurity layer 30 retained, the impurity of then-type impurity layer 46 can be distributed broad.

Then, by wet etching with, e.g., hydrofluoric acid aqueous solution, thesilicon oxide film 14 is removed. At this time the device isolationinsulating film 58 has not been formed on the silicon substrate, and thefilm thickness decrease of the device isolation insulating film 58 dueto the etching of the silicon oxide film 14 does not take place.

Then, by wet etching with, e.g., TMAH (Tetra-Methyl Ammonium Hydroxide),the surface of the silicon substrate 10 is etched by about 3 nm.

Next, by, e.g., CVD method, a non-doped silicon layer 48 of, e.g., a 40nm-thickness is grown on the surface of the silicon substrate 10 (FIG.8).

Next, by photolithography, a photoresist film 50 covering thelow-threshold voltage/low-voltage NMOS transistor forming region 16L andthe low-threshold voltage/low-voltage PMOS transistor forming region 24Land exposing the rest region is formed. For the alignment for thephotolithography, the trench 12 is used as the alignment mark.

Then, by wet etching with, e.g., TMAH or hydrofluoric acid-nitric acidsolution (HF/HNO₃/H₂O) and with the photoresist film 50 as the mask, thesilicon layer 48 in the region not covered by the photoresist film 50 isetched by about 10 nm (FIG. 9).

Thus, the film thickness of the silicon layer 48 in the high-thresholdvoltage/low-voltage NMOS transistor forming region 16H, thehigh-threshold voltage/low-voltage PMOS transistor forming region 24H,the high voltage NMOS transistor forming region 32 and the high voltagePMOS transistor forming region 40 becomes 30 nm. The film thickness ofthe silicon layer 48 in the low-threshold voltage/low-voltage NMOStransistor forming region 16L and the low-threshold voltage/low-voltagePMOS transistor forming region 24L, which has not been etched remains 40nm.

To form the silicon layer 48 of 2 kinds of the film thickness, 1 step oflithography is added. However, as described above, the lithography stepin the channel ion implantation step can be decreases by 2 steps, andresultantly, the lithography steps are decreased by 1 step.

The silicon layer 48 is etched to differ the threshold voltage betweenthe high threshold voltage transistors and the low threshold voltagetransistors. It is preferable that the film thickness of the siliconlayer 48 in the respective regions is suitably set corresponding tovalues of the threshold voltages the respective transistors require.

In the present embodiment, the silicon layer 48 of the high-thresholdvoltage/low-voltage NMOS transistor forming region 16H, thehigh-threshold voltage/low-voltage PMOS transistor forming region 24H,the high voltage NMOS transistor forming region 32 and the high voltagePMOS transistor forming region 40 are the same but may not beessentially the same. It is preferable that the silicon layer 48 of therespective regions have film thicknesses selected suitably correspondingto threshold voltage, characteristics, etc. the respective transistorsrequired or required simplification of the steps.

Then, by, e.g., ashing method, the photoresist film 50 is removed.

Next, by, e.g., ISSG (In-Situ Steam Generation) method, the surface ofthe silicon layer 48 is wet oxidized under a reduced pressure to form asilicon oxide film 52 of, e.g., a 3 nm-thickness. As the processingconditions, for example, the temperature is set at 810° C., and theprocessing period of time is set at 20 seconds.

Then, above the silicon oxide film 52, a silicon nitride film 54 of,e.g., a 90 nm-thickness is deposited by, e.g., LPCVD method. As theprocessing conditions, for example, the temperature is set at 700° C.,and the processing period of time is set at 150 minutes.

Next, by photolithography and dry etching, the silicon nitride film 54,the silicon oxide film 52, the silicon layer 48 and the siliconsubstrate 10 are anisotropically etched to form a device isolationtrench 56 in the device isolation region containing the regions betweenthe respective transistor forming regions (FIG. 10). For the alignmentfor the photolithography, the trench 12 is used as the alignment mark.

Next, by, e.g., ISSG method, the surface of the silicon layer 48 and thesilicon substrate 10 are wet oxidized under a decreased pressure to forma silicon oxide film of, e.g., a 2 nm-thickness as the liner film on theinside walls of the device isolation trench 56. As the processingconditions, for example, the temperature is set at 810° C., and theprocessing period of time is set at 12 seconds.

Next, by, e.g., high density plasma CVD method, a silicon oxide film of,e.g., a 500 nm-thickness is deposited to fill the device isolationtrench 56 by the silicon oxide film.

Then, by, e.g., CMP method, the silicon oxide film above the siliconnitride film 54 is removed. Thus, by the so-called STI (Shallow TrenchIsolation) method, the device isolation insulating film 58 of thesilicon oxide film buried in the device isolation trench 56 is formed(FIG. 11).

Next, by, e.g., wet etching with hydrofluoric acid aqueous solution andwith the silicon nitride film 54 as the mask, the device isolationinsulating film 58 is etched by, e.g., about 30 nm. This etching is foradjusting the surface of the silicon layer 48 of the completedtransistors and the surface of the device isolation insulating film 58to be on the substantially the same height.

Next, by, e.g., wet etching with hot phosphoric acid, the siliconnitride film 54 is removed (FIG. 12).

Next, by, e.g., wet etching with hydrofluoric acid aqueous solution, thesilicon oxide film 52 is removed. At this time, the device isolationinsulating film 58 is never excessively etched because the impuritiesfor the channel ion implantation are not implanted in the deviceisolation insulating film 58.

Next, by thermal oxidation method, a silicon oxide film 60 of, e.g., a 7nm-thickness is formed. As the processing conditions, for example, thetemperature is set at 750° C., and the processing period of time is setat 52 minutes.

Next, by photolithography, a photoresist film 62 covering the highvoltage NMOS transistor forming region 32 and the high voltage PMOStransistor forming region 40 and exposing the reset region is formed.

Then, by, e.g., wet etching with hydrofluoric acid aqueous solution andwith the photoresist film 62 as the mask, the silicon oxide film 60 isetched. Thus, the silicon oxide film 60 in the low voltage NMOStransistor forming region 16 and the low voltage PMOS transistor formingregion 24 is removed (FIG. 13). At this time, the device isolationinsulating film 58 is never excessively etched because the impuritiesfor the channel ion implantation have not been implanted in the deviceisolation insulating film 58.

Then, by, e.g., ashing method, the photoresist film 62 is removed.

Next, by thermal oxidation method, a silicon oxide film 64 of, e.g., a 2nm-thickness is formed. As the processing conditions, for example, thetemperature is set at 810° C., and the processing period of time is setat 8 seconds.

Next, thermal processing of, e.g., 870° C. and 13 seconds is made in NOatmosphere to introduce nitrogen into the silicon oxide films 60, 64.

Thus, the gate insulating films 60 a of the silicon oxide film 60 areformed in the high voltage NMOS transistor forming region 32 and thehigh voltage PMOS transistor forming region 40. In the low voltage NMOStransistors forming region 16 and the low voltage PMOS transistorsforming region 24, the gate insulating films 64 a of the silicon oxidefilm 64 thinner than the silicon oxide film 60 are formed (FIG. 14).

Then, above the entire surface, a non-doped polycrystalline silicon filmof, e.g., a 100 nm-thickness is deposited by, e.g., LPCVD method. As theprocessing conditions, for example, the temperature is set at 605° C.

Next, by photolithography and dry etching, the polycrystalline siliconfilm is patterned to form the gate electrodes 66 in the respectivetransistor forming regions (FIG. 15).

Next, by photolithography and ion implantation, n-type impurity ions areimplanted selectively in the high voltage NMOS transistor forming region32 with the gate electrode 66 as the mask to form n-type impurity layers68 to be the LDD regions. The n-type impurity layers 68 are formed byimplanting, e.g., phosphorus ions under the conditions of 35 keVacceleration energy and 2×10¹³ cm⁻² dose.

Next, by photolithography and ion implantation, p-type impurity ions areimplanted selectively in the high voltage PMOS transistor forming region40 with the gate electrode 66 as the mask to form p-type impurity layers70 to be the LDD regions (FIG. 16). The p-type impurity layers 70 areformed by implanting, e.g., boron ions under the conditions of 10 keVacceleration energy and 2×10¹³ cm⁻² dose.

Next, by photolithography and ion implantation, n-type impurity ions areimplanted selectively in the low voltage NMOS transistor forming regions16 with the gate electrodes 66 as the mask to form n-type impuritylayers to be the extension regions. The n-type impurity layers 72 areformed by implanting, e.g., arsenic ions at 6 keV acceleration energyand 2×10¹⁴ cm⁻² dose.

Then, by photolithography and ion implantation, p-type impurity ions areimplanted selectively in the low voltage PMOS transistor forming regions24 with the gate electrodes 66 as the mask to form p-type impuritylayers 74 to be the extension regions (FIG. 17). The p-type impuritylayers 74 are formed by implanting, e.g., boron ions at 0.6 keVacceleration energy and 7×10¹⁴ cm⁻² dose.

Then, above the entire surface, a silicon oxide film of, e.g., an 80nm-thickness is deposited by, e.g., CVD method. As the processingcondition, for example, the temperature is set at 520° C.

Next, the silicon oxide film deposited above the entire surface isanisotropically etched to be left selectively on the side walls of thegate electrodes 66. Thus, the sidewall spacers 76 of the silicon oxidefilm are formed (FIG. 18).

Next, by photolithography and ion implantation, ion implantation is madeselectively in the low voltage NMOS transistor forming regions 16 andthe high voltage NMOS transistor forming region 32 with the gateelectrodes 66 and the sidewall spacers 76 as the mask. Thus, the n-typeimpurity layers 78 to be the source/drain regions are formed, and n-typeimpurities are doped to the gate electrodes 66 of the NMOS transistors.As the conditions for the ion implantation, for example, phosphorus ionsare ion implanted at 8 keV acceleration energy and at 1.2×10¹⁶ cm⁻²dose.

Next, by photolithography and ion implantation, ion implantation is madeselectively in the low voltage PMOS transistor forming regions 24 andthe high voltage PMOS transistor forming region 40 with the gateelectrodes 66 and the sidewall spacers 76 as the mask. Thus, the p-typeimpurity layers 80 to be the source/drain regions are formed, and p-typeimpurities are doped to the gate electrodes 66 of the PMOS transistors.As the conditions for the ion implantation, for example, boron ions areion implanted at 4 keV acceleration energy and 6×10¹⁵ cm⁻² dose.

Then, rapid thermal processing of, e.g., 1025° C. and 0 second is madein an inert gas ambient atmosphere to activate the implanted impuritiesand diffuse the impurities in the gate electrodes 66. The thermalprocessing of 1025° C. and 0 second is sufficient to diffuse theimpurities to the interfaces between the gate electrodes 66 and the gateinsulating films.

The channel portions of the low voltage NMOS transistors can retainsteep impurity distributions by carbon suppressing the diffusion ofboron, and the channel portions of the low voltage PMOS transistors canretain steep impurity distributions by the slow diffusion of arsenic orantimony. On the other hand, the channel portion of the high voltageNMOS transistor, in which no carbon is implanted, the diffusion is notsuppressed, and the channel portion of the high voltage PMOS transistor,in which phosphorus, whose diffusion constant is larger than arsenic andantimony, can have gradual impurity distribution.

Thus, the 6 kinds of the transistors are completed on the siliconsubstrate 10. That is, in the high-threshold voltage/low-voltage NMOStransistor forming region 16H, the high-threshold voltage/low-voltageNMOS transistor (HVt LV NMOS) is formed. In the low-thresholdvoltage/low-voltage NMOS transistor forming region 16L, thelow-threshold voltage/low-voltage NMOS transistor (LVt LV NMOS) isformed. In the low-threshold voltage/low-voltage PMOS transistor formingregion 24L, the low-threshold voltage/low-voltage PMOS transistor (LVtLV PMOS) is formed. In the high-threshold voltage/low-voltage POMOStransistor forming region 24H, the high-threshold voltage/low-voltagePMOS transistor (HVt LV PMOS) is formed. In the high voltage NMOStransistor forming region, the high voltage NMOS transistor (HV NMOS) isformed. In the high voltage PMOS transistor forming region, the highvoltage PMOS transistor (HV PMOS) is formed (FIG. 19).

Then, by salicide (self-aligned silicide) process, a metal silicide film84 of, e.g., a cobalt silicide film is formed on the gate electrodes 66,the n-type impurity layers 78 and the p-type impurity layers 80.

Next, above the entire surface, a silicon nitride film of, e.g., a 50nm-thickness is deposited by, e.g., CVD method to form the siliconnitride film as the etching stopper film.

Next, above the silicon nitride film, a silicon oxide film of, e.g., a500 nm-thickness is deposited by, e.g., high density plasma CVD method.

Thus, the inter-layer insulating film 86 of the layer film of thesilicon nitride film and the silicon oxide film is formed.

Next, the surface of the inter-layer insulating film 86 is polished by,e.g., CMP method to planarize.

Then, the contact plugs 88 buried in the inter-layer insulating film 86,interconnections 90 connected to the contact plugs 88, and others areformed, and the semiconductor device is completed (FIG. 20).

As described above, according to the present embodiment, the thresholdvoltage of the transistor including the epitaxial semiconductor layer inthe channel region are controlled by the film thickness of the epitaxialsemiconductor layer, whereby without varying the profile of the channelimpurity layer, the transistors of different threshold voltages can beformed. Thus, the step number of the photolithography for formingdifferent channel impurity layers can be reduced, and the manufacturingcost can be suppressed.

The device isolation insulating film is formed after the wells and thechannel impurity layers have been formed, whereby the introduction ofhigh concentrations of the channel impurities in the device isolationinsulating film is decreased, and the film thickness decrease of thedevice isolation insulating film in the etching step can be drasticallysuppressed. Thus, the planarity of the substrate surface is improved,and the generation of parasitic transistor channel can be prevented. Thesemiconductor device of high reliability and high performance can berealized.

A First Reference Example

A method of manufacturing a semiconductor device according to a firstreference example will be described with reference to FIG. 21. The samemembers of the present reference example as those of the semiconductordevice and the method of manufacturing the same according to theembodiment illustrated in FIGS. 1 to 20 are represented by the samereference numbers not to repeat or to simplify the description.

FIGS. 21A-21D are sectional views illustrating the method ofmanufacturing the semiconductor device according to the presentreference example.

In the present reference example, the process of making the channel ionimplantation in the p-type highly doped impurity layers 22, the n-typehighly doped impurity layers 30, etc. after the device isolationinsulating film 58 have been formed will be described.

First, in the silicon substrate 10, the device isolation insulating film58 is formed by STI method.

Next, above the active regions defined by the device isolationinsulating film 58, the silicon oxide film 14 as the protection oxidefilm is formed (FIG. 21A).

Next, by photolithography and ion implantation, the p-type highly dopedimpurity layer 22 is formed in the low voltage NMOS transistor formingregion 16.

Next, by photolithography and ion implantation, the n-type highly dopedimpurity layer 30 is formed in the low voltage PMOS transistor formingregion 24.

Next, thermal processing is made to recover the ion implantation damageand activate the implanted impurities.

Next, by wet etching with hydrofluoric acid aqueous solution, thesilicon oxide film 14 is removed to expose the silicon substrate 10 inthe active regions (FIG. 21C).

At this time, in the device isolation insulating film 58, highconcentrations of the impurities are introduced by the ion implantationfor forming the p-type highly doped impurity layer 22 and the n-typehighly doped impurity layer 30, whereby the etching of the deviceisolation insulating film 58 is accelerated. Especially, when arsenic isimplanted to form the n-type impurity layer 30 for the purpose ofobtaining steep impurity profiles or others, the etching rate increasein the low voltage PMOS transistor forming region 24 is conspicuous.

Accordingly, in etching the silicon oxide film 14, the device isolationinsulating film 58 is excessively etched, and the side surfaces of theactive regions are exposed.

Next, above the silicon substrate 10, the non-doped silicon layer 48 isepitaxially grown (FIG. 21D). At this time, the growth of the siliconlayer 48 starts from the surface and the side surface of the activeregion, and crystalline defects are introduced in the parts where thesilicon layers grown along different plane orientations are met, i.e.,in the edges of the device isolation insulating film 58.

The crystalline defects introduced in the silicon layer 48 muchinfluence the characteristics, such as leakage current increases, etc.,and are unpreferable.

The film thickness decrease of the device isolation insulating film 58also takes place in the following etching processes, and the filmdecrease of the device isolation insulating film 58 lowers the planarityof the substrate surface, which often causes inconveniences in theprocesses in later steps.

A Second Reference Example

A method of manufacturing a semiconductor device according to a secondreference example will be described with reference to FIGS. 22A to 24B.The same members of the present reference example as those of thesemiconductor device and the method of manufacturing the same accordingto the embodiment illustrated in FIGS. 1 to 20 are represented by thesame reference numbers not to repeat or to simplify the description.

FIGS. 22A to 24B are sectional views illustrating the method ofmanufacturing the semiconductor device according to the presentreference example.

In the present reference example, the method of manufacturing thesemiconductor device including low voltage transistors and high voltagetransistors is manufactured by the same process as in the firstreference example.

First, in the silicon substrate 10, the device isolation insulating film58 is formed by STI method.

Next, above the active regions defined by the device isolationinsulating film 58, the silicon oxide film 14 as the protection oxidefilm is formed (FIG. 22A).

Next, by photolithography and ion implantation, the p-type highly dopedimpurity layer 22 is formed in the low voltage NMOS transistor formingregion 16.

Next, by photolithography and ion implantation, the n-type highly dopedimpurity layer 30 is formed in the low voltage PMOS transistor formingregion 24.

Next, by photolithography and ion implantation, the p-type impuritylayer 38 is formed in the high voltage NMOS transistor forming region32.

Next, by photolithography and ion implantation, the n-type impuritylayer 46 is formed in the high voltage PMOS transistor forming region 40(FIG. 22B).

Next, thermal processing is made to recover the ion implantation damagesand activate the implanted impurities.

Next, by wet etching with hydrofluoric acid aqueous solution, thesilicon oxide film 14 is removed to expose the silicon substrate 10 inthe active regions.

At this time, as described in the first reference example, the deviceisolation insulating film is excessively etched in the low voltage NMOStransistor forming region 16 and the low voltage PMOS transistor formingregion 24, and the side surfaces of the active regions are exposed.

The impurity concentrations of the p-type impurity layer 38 and then-type impurity layer 46 are lower by about 1 place in comparison withthe impurity concentrations of the p-type highly doped impurity layerand the n-type highly doped impurity layer 30. Accordingly, the etchedamounts of the device isolation insulating film 58 in the high voltageNMOS transistor forming region 32 and the high voltage PMOS transistorforming region 40 are relatively small.

Next, above the silicon substrate 10, the non-doped silicon layer 48 isepitaxially grown (FIG. 23A). At this time, the growth of the siliconlayer 48 starts from the surface and the side surface of the activeregion, and crystalline defects are introduced in the parts where thesilicon layers grown along different plane orientations are met, i.e.,in the edges of the device isolation insulating film 58.

The crystalline defects introduced in the silicon layer 48 muchinfluence the characteristics of the transistors, such as leakagecurrent increases, etc., and are unpreferable.

Then, above the active regions, the silicon oxide film 60 to be the gateinsulating films 60 a for the high voltage NMOS transistor and the highvoltage PMOS transistor is formed (FIG. 23B).

Next, by photolithography and wet etching, the silicon oxide film 60 inthe low voltage NMOS transistor forming region 16 and the low voltagePMOS transistor forming region 24 is selectively removed (FIG. 24A).

At this time, the device isolation insulating film 58 is etched togetherwith the silicon oxide film 60, and in the low voltage NMOS transistorforming region 16 and the low voltage PMOS transistor forming region 24,the lower surface of the silicon layer 48 is exposed at the ends of thedevice isolation insulating film 58.

Next, above the active regions of the low voltage NMOS transistorforming region 16 and the low voltage PMOS transistor forming region 24,the silicon oxide film 64 to be the gate insulating films 64 a is formed(FIG. 24B).

Then, when the gate electrodes 66 are formed above the gate insulatingfilms 64 a, below the silicon layer 48 at the edges of the deviceisolation insulating film 58, parasitic transistor channels opposed tothe gate electrodes without the silicon layer 48 therebetween areformed. Such parasitic channels are unavoidable when the silicon layer48 is epitaxially grown and then 2 or more kinds of the gate insulatingfilms of different film thicknesses are formed.

A Third Reference Example

A method of manufacturing a semiconductor device according to a thirdreference example will be described with reference to FIGS. 25A to 30.The same members of the present reference example as those of thesemiconductor device and the method of manufacturing the same accordingto the embodiment illustrated in FIGS. 1 to 20 are represented by thesame reference numbers not to repeat or to simplify the description.

FIGS. 25A to 30 are sectional views illustrating the method ofmanufacturing the semiconductor device according to the presentreference example.

In the present reference example, the process of forming the deviceisolation insulating film 58 after the p-type highly doped impuritylayers 22 and the n-type highly doped impurity layers 30 have beenformed will be described.

First, photolithography and etching, the trench to be used as the markfor the mask alignment is formed in a region other than the product tobe formed region of the silicon substrate 10.

Next, above the entire surface of the silicon substrate 10, the siliconoxide film 14 as the protection film for the surface of the siliconsubstrate 10 is formed (FIG. 25A).

Next, by photolithography and ion implantation, the p-wells 20 and thep-type highly doped impurity layers 22 are formed in the low voltageNMOS transistor forming region 16 and the high voltage NMOS transistorforming region 32.

Next, by photolithography and ion implantation, the n-wells 28 and then-type highly doped impurity layers 30 are formed in the low voltagePMOS transistor forming region 24 and the high voltage PMOS transistorforming region 40 (FIG. 25B).

In the present reference example, the p-wells 20 and the p-type highlydoped impurity layers 22 are simultaneously formed in the low voltageNMOS transistor forming region 16 and the high voltage NMOS transistorforming region 32. In the low voltage PMOS transistor forming region 24and the high voltage PMOS transistor forming region 40, the n-wells 28and the p-type highly doped impurity layers 30 are formed.

When different channel impurity profiles are necessary for the lowvoltage transistor and the high voltage transistor, one morephotolithography step is added for the respective transistors.

Next, thermal processing is made to recover the ion implantation damageand activate the implanted impurities.

Next, by wet etching with hydrofluoric acid aqueous solution, thesilicon oxide film 14 is removed.

Then, above the silicon substrate, the non-doped silicon layer 48 isepitaxially grown (FIG. 26A).

Next, by STI method, the device isolation insulating film 58 is formedin the silicon substrate 10 and the silicon layer 48 (FIG. 26B).

Next, above the active regions, the silicon oxide film 60 to be the gateinsulating films 60 a of the high voltage NMOS transistor and the highvoltage PMOS transistors is formed (FIG. 27A).

Then, by photolithography and wet etching, the silicon oxide film 60 inthe low voltage NMOS transistor forming region 16 and the low voltagePMOS transistor forming region 24 is selectively removed (FIG. 27B).

Next, above the active regions of the low voltage NMOS transistorforming region 16 and the low voltage PMOS transistor forming region 24,the silicon oxide film 64 to be the gate insulating films 64 a is formed(FIG. 28A).

Then, above the entire surface, a polycrystalline silicon film 66 a isformed.

Next, by photolithography and ion implantation, an n-type impurity ionsare implanted into the polycrystalline silicon film 66 a in the lowvoltage NMOS transistor forming region 16 and the high voltage NMOStransistor forming region 32. Into the polycrystalline silicon film 66 ain the low voltage PMOS transistor forming region 24 and the highvoltage PMOS transistor forming 40, a p-type impurity ions are implanted(FIG. 28B).

Next, the polycrystalline silicon film 66 a is patterned to form thegate electrodes 66 in the respective transistor forming regions.

Next, by photolithography and ion implantation, n-type impurity layers72 to be the extension regions are formed in the low voltage NMOStransistor forming region 16. In the low voltage PMOS transistor formingregion 24, p-type impurity layers 74 to be the extension regions areformed. In the high voltage NMOS transistor forming region 32, n-typeimpurity layers 68 to be the LDD regions are formed. In the high voltagePMOS transistor forming region 40, p-type impurity layer 70 to be theLDD regions are formed (FIG. 29A).

Next, a silicon oxide film is deposited and anisotropically etched toform the sidewall spacers 68 on the side walls of the gate electrodes 66(FIG. 29B).

Next, by photolithography and ion implantation, n-type impurity layers78 to be the source/drain regions are formed in the low voltage NMOStransistor forming region 16 and the high voltage NMOS transistorforming region 32. In the low voltage PMOS transistor forming region 24and the high voltage PMOS transistor forming region 40, p-type impuritylayers 80 to be the source/drain regions are formed (FIG. 30).

Next, thermal processing is made to activate the implanted impurities.

Thus, above the silicon substrate 10, the low voltage NMOS transistor,the low voltage PMOS transistor, the high voltage NMOS transistor andthe high voltage PMOS transistor are formed.

In the present reference example, as the low voltage transistors, 1 kindof NMOS transistor and 1 kind of PMOS transistor are formed.

However, in many actual products, as both NMOS transistors and PMOStransistors, a low voltage transistor of a low threshold voltage is usedin circuit units requiring high operation, and a low voltage transistorof a high threshold voltage is used in circuit units requiring lowleakage current.

In the process of the present reference example, the photolithographystep is required 4 times when channel ion implantation is made to formthe low-threshold voltage/low-voltage NMOS transistor, thehigh-threshold voltage/low-voltage NMOS transistor, the low-thresholdvoltage/low-voltage PMOS transistor and the high-thresholdvoltage/low-voltage PMOS transistor. For simplify the manufacturingprocess and the resultant manufacturing cost reduction, it is desirableto form transistors of different threshold voltages by as a small numberof steps as possible.

Modified Embodiments

The above-described embodiment can cover other various modifications.

For example, in the above-described embodiment, as the basesemiconductor substrate, a silicon substrate is used, but the basesemiconductor substrate may not be essentially a bulk silicon substrate.Other semiconductor substrates, such as SOI substrate, etc., may beused.

In the above-described embodiment, as the epitaxially semiconductorlayer, a silicon layer is used, but the silicon layer is not essential.In place of the silicon layer, other semiconductor layers, such as SiGelayer, SiC layer, etc., may be used.

In the above-described embodiment, as the high voltage transistors, thehigh voltage NMOS transistor and the high voltage PMOS transistor areused, but plural kinds of high voltage transistors of differentthreshold voltages may be provided, as are the low voltage transistors.For this, the high-threshold voltage/high-voltage transistor is formedin a region where the thickness of the epitaxial semiconductor layer issmall, and the low-threshold voltage/high-voltage transistor is formedin the region where the thickness of the epitaxial semiconductor layeris large, whereby, as can be the low voltage transistors, the highvoltage transistors of plural different threshold voltages can be formedby setting the same the channel impurity implantation for them. However,the difference of the threshold voltage between the high-thresholdvoltage and the low-threshold voltage is smaller than that of the lowvoltage transistors.

In the above-described embodiment, the wells of the low voltage NMOStransistors and the high voltage NMOS transistor and the wells of thelow voltage PMOS transistors and the high voltage PMOS transistor areformed separately, but, as in the third reference example, the wells ofthe low voltage transistors and the well of the high voltage transistormay be formed simultaneously.

The structure, the constituent material, the manufacturing conditions,etc. of the semiconductor device described in the embodiment describedabove are one example and can be changed or modified suitably inaccordance with the technical common sense, etc. of those skilled in theart.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the inventionand the concepts contributed by the inventor to furthering the art, andare to be construed as being without limitation to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority andinferiority of the invention. Although the embodiments of the presentinventions have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

What is claimed is:
 1. A method of manufacturing a semiconductor devicecomprising: ion implanting a first impurity of a first conduction typein a first region and a second region of a semiconductor substrate toform a first impurity layer in the first region and the second region;epitaxially growing a semiconductor layer above the semiconductorsubstrate after ion implanting the first impurity; forming above thesemiconductor layer a mask exposing the first region and covering thesecond region; removing partially the semiconductor layer in the firstregion by using the mask; removing the mask after removing partially thesemiconductor layer; forming a first gate insulating film above thesemiconductor layer after removing the mask; forming a first gateelectrode on the first gate insulating film in the first region and asecond gate electrode above the first gate insulating film in the secondregion; forming a first source region and a first drain region in thesemiconductor layer in the first region; and forming a second sourceregion and a second drain region in the semiconductor layer in thesecond region.
 2. The method of manufacturing a semiconductor deviceaccording to claim 1, further comprising, before growing thesemiconductor layer, ion implanting a second impurity of a secondconduction type in a third region and a fourth region of thesemiconductor substrate to form a second impurity layer in the thirdregion and the fourth region; and after forming the first gate electrodeand the second electrode, forming a third source region and a thirddrain region in the semiconductor layer in the third region; and forminga fourth source region and a fourth drain region in the semiconductorlayer in the fourth region, wherein in forming the mask, the maskexposing the first region and the third region and covering the secondregion and the fourth region is formed above the semiconductor layer, inremoving partially the semiconductor layer, the semiconductor layer isremoved partially in the first region and the third region by using themask, in forming the first gate electrode and the second gate electrode,a third gate electrode is further formed above the first gate insulatingfilm in the third region and a fourth gate electrode is further formedabove the first gate insulating film in the fourth region.
 3. The methodof manufacturing a semiconductor device according to claim 1, furthercomprising, before growing the semiconductor layer, ion implanting athird impurity of the first conduction type in a fifth region of thesemiconductor substrate to form a third impurity layer in the fifthregion; and after forming the first gate electrode and the secondelectrode, forming a fifth source region and a fifth drain region in thesemiconductor layer in the fifth region, wherein in forming the mask,the mask further exposing the fifth region is formed above thesemiconductor layer, in removing partially the semiconductor layer, thesemiconductor layer in the fifth region is further removed partially byusing the mask, in forming the first gate insulating film, a second gateinsulating film which is different in the film thickness from the firstgate insulating film is further formed above the semiconductor layer inthe fifth region, in forming the first gate electrode and the secondgate electrode, a fifth gate electrode is further formed above thesecond gate insulating film in the fifth region.
 4. The method ofmanufacturing a semiconductor device according to claim 2, furthercomprising, before growing the semiconductor layer, ion implanting athird impurity of the first conduction type in a fifth region of thesemiconductor substrate to form a third impurity layer in the fifthregion; and after forming the first gate electrode and the secondelectrode, forming a fifth source region and a fifth drain region in thesemiconductor layer in the fifth region, wherein in forming the mask,the mask further exposing the fifth region is formed above thesemiconductor layer, in removing partially the semiconductor layer, thesemiconductor layer in the fifth region is further removed partially byusing the mask, in forming the first gate insulating film, a second gateinsulating film which is different in the film thickness from the firstgate insulating film above the semiconductor layer in the fifth region,in forming the first gate electrode and the second gate electrode, afifth gate electrode is further formed above the second gate insulatingfilm in the fifth region.
 5. The method of manufacturing a semiconductordevice according to claim 4, further comprising, before growing thesemiconductor layer, ion implanting a fourth impurity of the secondconduction type in a sixth region of the semiconductor substrate to forma fourth impurity layer in the sixth region; and after forming the firstgate electrode and the second electrode, forming a sixth source regionand a sixth drain region in the semiconductor layer in the sixth region,wherein in forming the mask, the mask further exposing the sixth regionis formed above the semiconductor layer, in removing partially thesemiconductor layer, the semiconductor layer in the sixth region isfurther removed partially by using the mask, in forming the first gateinsulating film, the second gate insulating film is further formed abovethe semiconductor layer in the sixth region, in forming the first gateelectrode and the second gate electrode, a sixth gate electrode isfurther formed above the second gate insulating film in the sixthregion.
 6. The method of manufacturing a semiconductor device accordingto claim 3, wherein forming the first gate insulating film and thesecond gate insulating film includes: thermally oxidizing thesemiconductor layer to form an oxide film above the surface of thesemiconductor layer; removing the oxide film in the first gateinsulating film forming region; and thermally oxidizing the surface ofthe semiconductor layer to form the first gate insulating film and toform the second gate insulating film of the oxide film further oxidized.7. The method of manufacturing a semiconductor device according to claim1, further comprising: after removing partially the semiconductor layerand before forming the first gate insulating film, forming a deviceisolation insulating film.
 8. The method of manufacturing asemiconductor device according to claim 1, wherein a thickness of thesemiconductor layer in the first region is thinner than a thickness ofthe semiconductor layer in the second region after removing partiallythe semiconductor layer in the first region.
 9. The method ofmanufacturing a semiconductor device according to claim 1, wherein thesemiconductor layer is a non-doped semiconductor layer.
 10. The methodof manufacturing a semiconductor device according to claim 1, whereinthe semiconductor layer is an epitaxial silicon layer.
 11. The method ofmanufacturing a semiconductor device according to claim 1, wherein thefirst source region and the first drain region are formed in thesemiconductor layer and the first impurity layer, and the second sourceregion and the second drain region are formed in the semiconductor layerand the first impurity layer.